梁水保，男，工学博士，新葡萄8883官网AMG副教授、硕士生导师、黄山学者学术骨干。2019年6月在华南理工大学获工学博士学位，后于英国拉夫堡大学电子制造研究团队从事博士后研究工作，2023年1月作为高层次人才引进加入新葡萄8883官网AMG，目前主要从事集成电路和电力电子中电子制造和电子封装互连结构在多物理场下微结构特征及其可靠性影响的相关工作，迄今已参与了多项国家自然科学基金及英国工程与自然科学基金（EPSRC）项目，在微电子可靠性、应用物理、加工制造等领域共计发表学术论文50余篇，多次获邀参加领域内电子元器件及封装可靠性类国际会议(ECTC、ESTC、ICEPT和ESREF等)和报道研究成果，曾获最佳论文奖和杰出论文奖，获邀担任半导体与电子技术国际研讨会(ISSET)技术委员会会员，更多相关信息及更新可参见：http://faculty.hfut.edu.cn/shuibao_liang

l   教育简历

2013 – 2019，华南理工大学，材料加工工程（微电子封装及可靠性方向），博士

2017 – 2018，英国拉夫堡大学，电子制造与电子封装，联合培养博士

l  工作简历

2023/1 – 至今， 新葡萄8883官网AMG，新葡萄8883官网AMG，副教授

2019 – 2022， 英国拉夫堡大学，机械电气和制造工程学院，博士后

l  科学研究

主要研究兴趣：半导体元器件封装集成与可靠性工程。具体方向包括：(1) 先进封装及功率器件中界面微结构演化行为与服役可靠性评价；(2) 电力电子器件封装热-力可靠性研究；(3) 电子封装互连结构物理失效分析；(4) 微电子制造过程模拟仿真计算。

l  学术论文

[1] S.  Liang, H. Jiang, Z. Zhong, S. Ramachandran, Insights Into the Grain   Orientation Effect on Electromigration-Induced Failure in Solder  Interconnects Through Phase Field Modeling, IEEE Trans. Electron Devices (2023) DOI: 10.1109/TED.2023.3309280.

[2] S.   Liang, C. Liu, H. Jiang, Z. Zhong, Investigation of Electric-thermal-mechanical  Effects in Electric Assisted Silver Sintering Process through Phase Field  Modelling, IEEE Trans. Compon. Packag. Manuf. Technol. 99 (2023).

[3] S.   Liang, C. Wei, A. Kunwar, U. Subedi, H. Jiang, H. Ma, C. Ke, Phase field    modelling combined with data-driven approach to unravel the orientation   influenced growth of interfacial Cu₆Sn₅  intermetallics under electric current stressing, Surf. Interfaces (2023) 102728.

[4] S.  Liang, X.P. Zhang, Unraveling the electric field effect on the grain‐boundary   migration in alumina through phase field modeling, J. Am. Ceram. Soc. 106   (2023) 1647-1652.

[5] S.  Liang, M.B. Zhou, C. Ke, C. Wei, X.P. Zhang, Study of migration and    coalescence of voids driven by electric current stressing in solder   interconnects using phase field simulation, Microelectron. Reliab. 138    (2022) 114611.

[6] S.  Liang, Y. Zhong, S. Robertson, A. Liu, H. Jiang, C. Liu, Z. Zhou, C. Liu,   Investigation of thermal effect on solidification in Sn/Cu interconnects   during self-propagating exothermic reaction bonding, Microelectron. Reliab. 138 (2022) 114654.

[7] S. Liang, C. Wei, C. Ke, S. Cao, M.B. Zhou, X.P. Zhang, Investigation of the    Interaction Effect Between the Microstructure Evolution and the  Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via, IEEE Trans.  Device Mater. Reliab. 22 (2022) 267-275.

[8] S. Liang, C. Liu, Z. Zhou, Phase field study of grain boundary migration and  preferential growth in non-magnetic materials under magnetic field, Mater. Today Commun. 31 (2022) 103408.

[9] S. Liang, A. Kunwar, C. Liu, H. Jiang, Z. Zhou, Preferential growth of   intermetallics under temperature gradient at Cu–Sn interface during   transient liquid phase bonding: insights from phase field simulation, J.  Mater. Res. Technol. 19 (2022) 345-353.

[10] S.   Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, Thermo-mechanical   characteristics and reliability of die-attach through self-propagating   exothermic reaction bonding, IEEE Trans. Compon. Packag. Manuf. Technol.  11 (2021) 2122-2129.

[11] S.  Liang, A. Kunwar, C. Wei, C. Ke, Insight into the preferential grain   growth of intermetallics under electric current stressing–A phase field   modeling, Scr. Mater. 203 (2021) 114071.

[12] S.   Liang, C. Ke, C. Wei, J.Q. Huang, M.B. Zhou, X.P. Zhang, Microstructural   evolution and change in macroscopic physical properties of microscale   flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric  current stressing and elastic stress, J. Mater. Res. 34 (2019) 2775-2788.

[13] S.  Liang, C. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field modeling of   grain boundary migration and preferential grain growth driven by electric    current stressing, J. Appl. Phys. 124 (2018) 175109.

[14] S.   Liang, C. Ke, W. Ma, M.-B. Zhou, X.P. Zhang, Numerical simulations of   migration and coalescence behavior of microvoids driven by diffusion and   electric field in solder interconnects, Microelectron. Reliab. 71 (2017)   71-81.

l  会议报告

[1] 梁水保,       3D封装微凸点焊点界面IMC在物理场下优先生长的机制研究, 2023 电子封装材料与测试技术创新大会, 贵阳, 中国, 10月20-22日, 2023, 邀请报告.

[2] S.       Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, Investigation of       thermo-mechanical and phase-change behavior in the Sn/Cu interconnects       during self-propagating exothermic reaction bonding, The 70th Electronic       Components and Technology Conference (ECTC), IEEE, Orlando, FL, USA, May.       30-Jun. 3, 2020, pp. 269-275.

[3] S.       Liang, C.Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of       Kirkendall voids at the interface of microscale Sn/Cu system lead-free       interconnects, The 15th International Conference on Electronic Packaging       Technology, IEEE, Chengdu, Aug. 12-15, 2014, pp. 641-645.

[4] S.       Liang, C. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of       segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects       under electric current stressing,  The 66th Electronic Components       and Technology Conference (ECTC), IEEE, Las Vegas, NV, USA, May. 31-Jun.       3, 2016, pp. 264-270.

[5] S.       Liang, C. Ke, M.Y. Tan, M.B. Zhou, X.P. Zhang, Phase field simulation of       the microstructural evolution and electromigration-induced phase       segregation in line-type Cu/Sn-Bi/Cu solder interconnects, The 17th       International Conference on Electronic Packaging Technology (ICEPT),       IEEE, Wuhan, Aug. 16-19, 2016, pp. 836-840.

[6] S.       Liang, X.P. Zhang, C. Wei, C. Ke, C. Liu, Interaction effects between the       preferred growth of β-Sn grains and thermo-mechanical response in       microbump interconnects under thermal cycling, The 7th Electronic       System-Integration Technology Conference (ESTC), IEEE, Dresden, Germany,       Sep. 18-21, 2018, pp. 1-7.

l  科研获奖

[1] 2016年，第17届电子封装技术国际会议最佳学生论文奖 (Cisco & ASE Best Student Paper Award)，国际电气电子工程师联合会电子元件封装和生产技术学会（IEEE-CPMT）、中国电子学会

[2] 2014年，第15届电子封装技术国际会议杰出论文奖       (JCAP Outstanding Paper Award)，国际电气电子工程师联合会电子元件封装和生产技术学会（IEEE-CPMT）、中国电子学会